I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We’ve had a hot week in this industry. In my picks for this week, we introduce a new SMT007 columnist, and we have a look at the CHIPS Act one year later. We have a great article about sourcing diversification, and a look at the latest electronics news coming out of India. And columnist Vern Solberg explains DFM best practices for flexible circuits.
Sourcing Diversification – Empowering Your Supply Chain for Success
In today's interconnected and rapidly evolving business landscape, sourcing diversification has emerged as a crucial strategy for organizations aiming to stay competitive and thrive in a dynamic marketplace. The traditional approach of relying on a single source for procurement is being replaced by a more sophisticated and strategic mindset that emphasizes the advantages of exploring multiple procurement channels. This approach not only opens doors to a whole different network of suppliers, but also offers numerous benefits, such as navigating sales increases, ensuring smoother deliveries, and promoting innovation within the organization.
An Overview of Rigid-flex Design
For this month’s issue on rigid-flex design, we spoke with instructor Kris Moyer, who teaches the IPC class “PCB Design for Flex and Rigid-Flex Boards.” In this wide-ranging interview, Kris breaks down the hurdles facing rigid-flex designers and offers a variety of solutions for rigid board designers taking on their first rigid-flex circuits. He also provides a few horror stories to illustrate what happens if you don’t follow sound design practices, rules, and standards. And, as Kris points out, “Your fabricator is your friend.”
Book Excerpt: 'The Printed Circuit Designer's Guide to... Manufacturing Driven Design,' Chapter 4
In Chapter 4 of 'The Printed Circuit Designer's Guide to... Manufacturing Driven Design,' the author, Max Clark, explores industry advancements that bridge the gap between concurrent and intelligent DFM. Both systems complement each other within the typical workflow and represent the beginnings of a transition away from a classical DFM, allowing for an improved NPI process.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
As I looked over the news and stories of the week, I noticed "firsts" from Insulectro and Lockheed Martin, plus a historic transition in leadership at Foxconn. There’s also financial health from KLA, and upbeat market data from IPC. With the start of a new school year, and often a fiscal year, September brings a sense of newness and change for many of us.
Three Ways to Improve High-Speed PCB Signoff, Part 1
Signal integrity (SI) and power integrity (PI) are top priorities for engineers designing today’s high-speed, high-density circuit boards, and faster signoff of designs can be achieved by uncovering SI/PI issues early in the design process, before costly respins are required. Three key issues engineers need to overcome to sign off on high-speed PCB designs include power analysis, serializer/deserializer (SerDes) link compliance, and double data rate (DDR) memory interface compliance.
Challenges in Modern PCB Design and Analysis
Zuken recognizes the need to address innovation in all areas of the design process while remaining responsive to customer-driven requirements. While we can make predictions about various challenges, concerns, and requirements, our customers play a vital role in shaping the company’s development direction. They have the benefit of being “in the trenches,” so to speak, on a daily basis, so they are the subject matter experts and can help identify gaps in our tools based on where their processes are heading.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
As we head into the Labor Day weekend, we have a variety of articles for this week’s editor’s picks. Hannah Nelson discusses the onboarding process she went through when she started a new job. Gaurab Majumdar explains why tech companies should consider hiring workers from India. Happy Holden details the importance of great sensor technology and why sensors are a critical ingredient in Smart manufacturing processes. Mike Brask discusses the new IPS ENIG line installed at the SEL facility in Idaho, and Chris DeMartino explains how Modelithics works to provide simulation models, primarily for the RF/microwave community.
PCB Design, Digital Twin, and Digital Transformation
There’s been a lot of talk lately about digital twin and its use in PCB fabrication and assembly. Manufacturers have been quick to get onboard the digital twin train. But what about PCB designers and design engineers? Can the front-end folks benefit from digital twin? We asked David Wiens, Xpedition product manager for Siemens Digital Industries Software, to weigh in on this topic. He’s been involved with digital twin for years, and he explained what digital twin can potentially offer to PCB design, and why he believes designers have been using digital twin for decades, whether they realize it or not.
Model Citizens: Modelithics
We recently asked Chris DeMartino, an applications engineer at Modelithics, to discuss the company’s focus on providing simulation models, primarily for the RF and microwave segments. In this interview, Chris explains the Modelithics business “model” and why the need for good models continues to grow at a rapid pace.
3D Electromagnetic Analysis
Data rates in PCB interconnects are increasing in all signaling protocols (PCIe, DDR, GDDR, Ethernet, USB, SAS, InfiniBand, CEI, OIF, 5G). Most of those high-speed signaling standards have one-lane data rates over 6 Gbps (GT/s) and some up to 112 Gbps with signal spectrum in microwave and even millimeter wave bandwidths. Design of compliant interconnects at these data rates cannot simply rely on geometrical rules or rules of thumb. Signal distortion by reflections, dissipation and crosstalk can cause interconnect performance degradation or even failure. To avoid it, signal integrity compliance analysis and possible interconnect optimization is required.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, we have an article about flex-hybrid electronics, which the military and aerospace folks are following closely. We have an article about the digital twin and what it is—and what it’s not. We have 10 outside-the-box ideas for closing the deal—be sure to forward this to your sales team. John Perry brings us an interview with a father/son team of IPC volunteers. (Would you want your children to work in this industry?) Finally, John Watson discusses AI, simulation and SPICE, and what they have to offer for PCB designers.
The Fabric of Our Lives: A Closer Look at Standards for E-Textiles
The e-textiles industry recognizes IPC as a leader in standards development for the greater electronics industry, and in 2017 asked IPC for assistance to develop global standards for materials, design, and manufacture of e-textiles. Volunteers quickly adapted to IPC’s processes by integrating themselves into the fabric (pun intended) of IPC’s global standardization efforts.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, we have news about APCT’s acquisition of San Diego PCB Design, and PCBAA’s continued push to impress upon Congress the need to support electronics manufacturing in the U.S. Steve Williams breaks down the details behind Lean manufacturing, TQM and Six Sigma. Columnist Tim Haag explains how he learned to design advanced and complex PCBs. And Nolan Johnson has a great interview with Daniel Barish of Celanese, who discusses some of the company’s latest low-temperature co-fired ceramics and their advantages.
I-Connect007 Editor’s Picks: Five Must-Reads for the Week
Holy mackerel, dear readers, you’ve been reading the good stuff this past week. I won’t need to steer you toward any of the must-read (but sometimes overlooked) content because your collective reading habits (as measured by clicks and reads) gravitated to the same things as I did. This week’s picks include an interview from IPC Community magazine on sustainability, two pieces on space travel technology, a new partnership between two well-known companies in our industry, and the July market report from IPC. Keep reading to see what I’m talking about.
Book Excerpt: 'The Printed Circuit Designer's Guide to... Manufacturing Driven Design'
Our latest I-007eBook, brought to you by Siemens, introduces a new process workflow for optimizing your design called Manufacturing Driven Design (MDD) and is a distinct evolution from DFM. When defining Manufacturing Driven Design, it is important to recognize that this is, foremost, an element of the design stage.
Mil-Aero Design: Not Just Another High-Rel Board
Meijing Liu, CID+, is a senior PCB designer for Microart Services, an EMS company in Markham, Ontario, Canada. She recently took a six-week mil-aero PCB design class from IPC’s Kris Moyer, and she was surprised at how much content she was able to absorb in such a short time. I spoke with Meijing and we discussed some of her takeaways from the class, and how it has inspired her to pursue more design education in the future.
Solving the Challenge of the Workforce Pipeline: A New Resource to Careers in Electronics
An aerospace engineer walks onto the job at $72,770 and can double their salary in just a few years. In fact, careers in the electronics industry can provide a sizable salary, but exactly how much will you make? A new resource from the IPC Education Foundation breaks down the most common career paths in electronics manufacturing, from operators to owners. What jobs are available? What does someone in the electronics industry even do?
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week’s must-reads follow the trend toward iterative and ongoing improvements and advancements. The must-know news this week includes coverage of SEMICON (based on reader interest), updates on the EU’s Chips Act and ongoing advocacy for the printed circuits sector, design tips from an aerospace engineer, and a PCB fabrication merger.
RF Antenna Design on the Bleeding Edge
At SMTA Atlanta Tech Expo and Forum, I met with PCB designer Albert Gaines, owner of HiGain Design Services. Albert has been working on some really interesting, fragmented aperture antenna designs, and some of this stuff is really pushing the limits. Albert and I discussed his work with RF, the differences between COTS and custom antennas, and his efforts to educate engineers about what they can and can’t do.
Designing Aerospace PCBs: A Galaxy of Challenges
Jeffrey Boye designs aerospace PCBs at the Johns Hopkins University Applied Physics Laboratory. After a decade or so at the APL, some of his boards are currently floating in space. Jeffrey recently took a class with IPC instructor Kris Moyer titled “PCB Design for Military and Aerospace Applications.” As Jeffrey explains in this interview, this exhaustive class covered everything from high-reliability DFM techniques to Paschen’s curves, which help engineers understand and predict how a high-voltage signal travels in different atmospheres. He also discusses some of the “wacky” projects that he’s worked on at the APL, and the need to communicate with fabricators early on with aerospace applications.
Mark Thompson's Biggest Problems With PCB Designs
What are the top problems I see with PCB design? From where I sit now on the assembly side, one of my biggest concerns related to PCB design is the lack of uniform part markings on the Gerber or ODB++ data, specifically the way customers reference diodes. We would prefer either an “A” depicting the anode side or a “C” or “K” for the cathode side. Many customers simply use either a line or a dot, which requires us to contact them to clarify which side is the cathode and which side is the anode.
What Are Hiring Managers Looking For?
Paul Farquhar recently took a few PCB design classes from John Watson, who doubles as a Palomar College professor when he’s not working at Altium. John teaches classes on basic and advanced PCB design, and he works to help students land jobs afterward. I asked Paul to discuss what he learned in John’s classes, as well as where he hopes to work afterward and how John and the college are working with industry to provide trained designers for the many open PCB designer positions.
Are You Still Over-materializing?
During the recent IEEE IMS2023 Exhibition in San Diego, we caught up with James Hofer, general manager of Accurate Circuit Engineering (ACE). The company is a prototype manufacturer of bare printed circuit boards that specializes in high-mix, low volume with an emphasis on RF, microwave, and antennas. A few years ago, we talked to James about the over-materialization of boards. In this recent discussion, we wanted to know if anything has changed regarding materials and approach. James also shares his thoughts on the changes in the design community.
Isola Changing With the Times
Changing market conditions require changes in approach. I-Connect007’s Barry Matties and Nolan Johnson speak with Isola’s Travis Kelly, Sean Mirshafiei, and Kirk Thompson about Isola’s recent responses to market conditions. In this interview, Kelly, Mirshafiei and Thompson outline recent changes to Isola senior leadership, optimizing manufacturing to meet the needs of the global market, and the strategic importance of advanced packaging to the global economy, and to the U.S., in particular.
Design Challenges: From The Assembler’s Viewpoint
Fabricators are fairly vocal about the design issues that they encounter, especially with brand-new customers. They are, after all, the next step in the process. But we don’t hear as much about design issues from EMS providers. This month, we asked experts from the PCB assembly segment to share their thoughts about design challenges that affect technologists on the EMS side.
EIPC Summer Conference 2023: Day 1 Review
Mid-morning on June 15 in Munich, after the conclusion of an informative and thought-provoking keynote session, the EIPC Summer Conference got under way with a series of presentations on Smart manufacturing, introduced and moderated by EIPC board member Dr. Michele Stampanoni, vice president strategic sales and business development at Cicor Group.
Altium 365 GovCloud Offers Increased Security
Altium recently launched Altium 365 GovCloud, a dedicated platform accessible only to—and managed solely by—U.S. persons. The company says that GovCloud can help customers to be in compliance with ITAR, EAR, and other requirements. I spoke with Bruno Blasigh, Director of Cloud Security for Altium 365, about the new platform, how it functions, and how GovCloud can help to keep foreign entities from accessing your data.
Reassessing Surface Finish Performance for Next-gen Technology, Part 1
Over the years, various surface finishes have been successfully utilized, namely organic solderability preservative (OSP), immersion silver (ImAg), immersion tin (ImSn), electroless nickel immersion gold (ENIG), and electroless nickel electroless palladium immersion gold (ENEPIG), as solderable finishes for PCB and package substrates. All these surface finishes have their pros and cons, with no single finish being suited to all applications. As system designers continue to respond to new performance demands, it can be noted that ENIG/ENEPIG finishes have endured as a leading choice in many advanced applications where reliability is prioritized over cost.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 21 marked the first official day of summer, and it’s the longest day of the year. I’m wearing by best Hawaiian shirt right now. But we’ve been too busy to hit the beach yet. There’s a lot going on in our industry right now. In this week’s Top 5, we have our coverage of the recent SMTA Oregon Expo & Tech Forum, a show that drew a good crowd of technologists.
Rigid-flex, Rigidized Flex, or Hybrid Flex?
In a recent interview with Design007 Magazine managing editor Andy Shaughnessy, he asked me about rigid-flex and its new popularity. This seems like a perfect opportunity to dig into the topic and discuss the differentiation between rigid-flex, rigidized flex, and what I am calling a hybrid flex.
PCB Design Challenges—From the Fabricator’s Viewpoint
If you’re a fabricator, chances are you have a few things to say about at least a few of the PCB designs that make their way through your shop. I guarantee that you have several well-worn stories about designs that made you scratch your head and think, “Hmmmm.” So, in this section, we asked PCB fabrication experts to share their thoughts about challenges that PCB designers need to more thoroughly understand. Do you see yourself on either side of these issues?
It’s a Team Effort: Final Episode in Sustainability Series Out Now
Available on I-007e and Spotify, Episode 6 of I-Connect007’s podcast, On the Line with… features an interview with Siemens’ Jonathan Fromm, product owner in predictive analytics, who introduces us to the “eight R’s” of sustainability. Fromm also draws parallels between the idea of thinking globally and the act of crafting holistic sustainability initiatives.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s always interesting to see what themes emerge from reader interest in our news coverage over the past seven days. This week, there are two: making plans and Southeast Asia. Our curated list of must-read content includes planning for the following items: new courses from IPC, a new listing on the NYSE, a new manufacturing facility for materials in Southeast Asia, brand-new inspection equipment solutions for SEMICON West, and new air traffic management systems in Indonesia.
IEEE IMS Show: A High-Speed Designer’s Paradise
The IEEE International Microwave Symposium is underway this week at the San Diego Convention Center, and the I-Connect007 team is on site for the opening of the exposition. For a PCB designer or design engineer, virtually all the sources for board raw materials were present on the show floor: semiconductors, board material suppliers, fabricators, design bureaus, design tool vendors, EMS equipment manufacturers, solder, and more.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s summertime, but the industry is staying pretty busy. This week, we have news about our industry putting pressure on our elected officials to provide funding for U.S. companies under the CHIPS Act, and a counterfeit parts symposium presented by SMTA in Maryland next month. We also bring you articles about ultra HDI design and material selection, and our most recent On the Line with… podcast with Zac Elliott of Siemens.
DFM 101: Cost Driver Summary
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. We will wrap up this DFM series with a summary of cost drivers that impact delivery, quality and reliability. It is categorized by low-, medium-, and high-cost adders.
Slash Sheets: Don’t Fall Into the Trap
Slash sheets can be confusing, and this is a big topic, so let’s start big and drill down from there. Here’s the big picture regarding slash sheet references: They were designed to provide handy groupings of PCB materials (laminates, polyimides, etc.) that go into a stackup. These groupings are designed around mechanical characteristics to provide insight for PCB fabricators to identify similar laminates with similar properties.
Sustainability in Logistics Discussion Continues
Episode 5 of I-Connect007’s podcast, On the Line with… features an interview with Zac Elliot, Siemens technical marketing engineer, who discusses sustainability in logistics internal to the factory. Listeners will hear how ineffective logistics create wasted effort in the form of ineffective materials transfers, or increasing line down-time when materials are not flowing to the line properly.
Slash Sheets and Material Selection
Doug Sober helped pioneer the development of IPC’s first slash sheets in 1996 for IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards and we asked him to discuss slash sheets—what they are, what they are not, and why PCB designers might benefit from an IPC materials guide developed specifically for designers.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s been a busy week here at I-Connect007, an even busier week for PCB designers and manufacturers. This week, we published a variety of articles and news items. In this week’s wrap-up, we have an interview with Rex Rozario that is basically a historical look at the birth of commercial PCB manufacturing, and his involvement with the Rolling Stones in their early days. Then we bring you a look at trends in freight costs, which are—fortunately—heading southward right now.
Selecting Flex Materials: Do Your Homework
While the layout of the circuit gives us much of the electrical characteristics of the design, your choice of materials can affect the mechanical and electrical characteristics of the circuit. Material choices affect not only the design of the circuit for its environment, but also the manufacturing and assembly processes. While the layout of the circuit gives us much of the electrical characteristics of the design, your choice of materials can affect the mechanical and electrical characteristics of the circuit.
Stop Over-specifying Your Materials
Columnist Kelly Dack has had a pretty wide range of experiences. As a PCB designer, he has sat behind the desk at an NPI company, an OEM, a fabricator, and now an EMS provider. We asked him to share a few thoughts on the materials selection process and how it could be improved.
Mark Laing Talks ‘Sustainability in Manufacturing’
Now available on Spotify, Episode 3 of I-Connect007’s new podcast, On the Line with… features an interview with Mark Laing, business development manager for digital industries software at Siemens. Laing discusses the role of electronics in achieving sustainability. Not only does the electronics industry have a primary role to play here, but it also contributes by creating products which enable other industries to monitor and optimize their sustainability practices.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, our must-reads include reporting on the new PCB support legislation, now submitted to the U.S. House of Representatives; financial results from two Tier 1 manufacturers, which readers read quite thoroughly; ESG in Asia Pacific; new features from Altium; global sourcing; and a “How I got here” interview with an up and coming industry expert.
Sustainability Podcast: Episode 2 'Sustainability Through Cloud Applications' Now Available
Now available on Spotify, Episode 2 of I-Connect007’s new podcast, On the Line with… features an interview with Susan Kayesar of Siemens. Kayesar addresses cloud applications and sustainability, as well as some key, new best practices that emerge from using a cloud-based platform for business operations software systems.
Guru & Geezer: A Celebration of the Life of Martin Cotton
This last weekend, industry guru and dear friend to many, Martin Cotton passed away. He was one of the first people I worked with in the electronics industry when I joined Toptec Design to learn to layout PCBs. He was a bit of a rock star to many PCB designers, myself included. He was known to be among the best in his field, if not the best, and went on to be one of the most influential and innovative people in the industry over a long and distinguished career. He will be hugely missed by his family and by his numerous friends in and out of the electronics industry.
NCAB Advocates for Advanced Technologies
At the SMTA Atlanta Expo and Tech Forum, I spoke with NCAB Group Field Application Engineer Ramon Roche, who gave a presentation at the show titled, “Technical Trends in the Global PCB Industry.” Ramon and I discussed his presentation, the emerging technologies that have NCAB’s focus over the next few years, and why semi-additive processes may be the key to succeeding with ultra HDI technology.
May 17 Webinar: The Economic Impact of Altium 365
I recently spoke with Fabian Winkler, product marketing manager for Altium 365. He and guest speaker Casey Sirotnak of Forrester are co-hosting a free webinar on May 17 titled “Unveil the Total Economic Impact of Altium 365.” The webinar will include data from a Forrester case study that examined the economic benefits of using the Altium 365 environment, such as the number of hours saved per designer per year. I asked Fabian to discuss the focus of the webinar, who should attend, and some of the benefits of this environment that allows ECAD and MCAD engineers to collaborate seamlessly.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week’s must-reads contains a veritable potpourri of information from around the industry. We have a Pete Starkey review of the latest EIPC webinar on ultra HDI and thin film resistors, an interview with the founder of an electronics trade school in Texas, and an update from PCBAA about their lobbying efforts in Washington. We also have news about our brand-new podcast, or “pod,” as the kids say, and a column about the wisdom of Don Draper that just might serve technologists and managers well. Read on, folks!
I-Connect007 Launches 'On the Line with...' Podcast with Series on Sustainability
Expanding its avenues of content delivery, I-Connect007 is excited to announce the launch of our latest educational product, On the Line with.., available on Spotify, Apple and all the major podcast platforms. In this podcast, we speak with industry experts to get the latest insights and perspectives on the most relevant topics in the electronics industry today.
EIPC Review: Ultra-high-density Interconnects, Thin-film Resistor Materials
It’s been a little while since I first had the opportunity to review an EIPC Technical Snapshot webinar. This excellent series began in October 2020 when our industry was besieged by the COVID-19 pandemic. It has continued successfully as restrictions have lifted and provides an effective channel for the efficient sharing of relevant knowledge that complements the traditional live conferences. The 20th in the series, in December 2022, focused on environmental issues impacting the electronics industry. In early February, EIPC held its live Winter Conference in Lyon and now, by popular demand, the 21st Technical Snapshot fills a slot before the Summer Conference scheduled for mid-June in Munich.
DownStream Discusses Rigid-flex and DFM Trends
I recently sat down with Joe Clark, founder, and Ray Fugitt, technical marketing manager, of DownStream Technologies to discuss trends in tool design and manufacturing, including rigid-flex design and refreshed graphical user interfaces (GUI).
Electronic System Design Industry Logs $3.9B in Revenue in Q4 2022
Electronic System Design (ESD) industry revenue increased 11.3% from $3,468.2 million in the fourth quarter of 2021 to $3,858.7 million in the fourth quarter of 2022, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
In this week’s must-reads, we have coverage of NAMM 2023 and SMTA Atlanta, plus some tips for traditional PCB designers who are entering the RF design space, where designers have to master ideas like antenna tuning. We also have some news about March PCB sales, as well as a great conversation with Ventec’s Frank Lorentz, who explains how to set up an onboarding process that converts new hires into happy, long-term employees.
RF Antenna Design and Layout Tips for Your PCB
These days, it’s hard to think of a consumer product that doesn’t contain an antenna. Even my garage door opener can connect to my phone via Bluetooth or Wi-Fi. Each time a new RF antenna gets added to a PCB layout, it can create a new headache for RF designers, especially as analog design skills start to become critical again. With so many RF capabilities being added to new PCBs, how can designers ensure the signals in their system are not corrupted and signal integrity is preserved?
RF and Wireless Design Means Fighting Interference, Loss
Keysight EDA has been in the RF and microwave design industry for decades. We asked How-Siang Yap, product manager for Keysight EDA’s RF and microwave software tools, to share his thoughts on RF design tips and techniques, and how designing boards at RF speeds compares with designing PCBs at slower speeds. As he explains, much of RF design involves battling interference and loss.
Design for Cost in Real-time
When do you first start thinking about the selling price of your new product? It’s impossible to avoid the question of what the price will be. The worst answer is: “I don’t know, let’s see after the first samples.” Let’s say the product’s selling price is $49; then the manufacturing cost will be $20. During each design change, the manufacturing cost should be recalculated to make sure the product is still competitive. This means you should involve people from both the development and cost calculation teams. This circle will be repeated until the final design is released, and the final calculation is done.
NAMM 2023: It’s All About That Bass
The use of AI in the music industry seems only natural. For example, if you’re trying to create a specific sound, rhythm, mix of instruments, or volume level, you’d typically be in front of a series of mixers and controls, making tweaks and adjustments. If you’re trying to create a piece of music that is similar to one you already have, AI can do that for you. Just give it some basic instructions and let it go to work.
DFM Analysis for Flex and Rigid-flex Design, Part 1
Flex and rigid-flex PCB constructions are not new concepts. It has become commonplace as engineers look for alternative circuit packaging for ever-shrinking electronic products. A flat, one-sheet schematic for a straight ribbon cable is analogous to its physical flat substrate. A flat, multi-sheet schematic that details circuitry for a rigid-flex design bears little visual resemblance to its three-dimensional, variable material rigid-flex assembly. However, in both schematic examples, schematic-based analysis tools are applied equally. This same truth also applies to common FR-4-based two-layer or multilayer PCBs.
RF PCB Design: The Devil’s in the Details
Altium’s John Watson is a longtime designer and design instructor, not to mention a Design007 columnist. He’s been dealing with RF issues for years; his previous employer, Legrand, is one of the pioneers in smart lighting and data center solutions. John discusses the differences between designing RF and “typical” PCBs, how to avoid the missteps and miscues that can bedevil new RF designers, and why the tiniest details can make or break an RF design.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
How was your week? We’ve been pretty busy ourselves, bringing you coverage of the SMTA Expo & Tech Forum in Boise, Idaho. Tabletops shows like this offer a great value during the spring, in between the bigger shows like IPC APEX EXPO and SMTA International. In fact, SMTA schedules approximately 30 regional shows around the United States and abroad.
Better Engineering Through Artificial Intelligence
At DesignCon 2023, I spoke with Cadence Design Systems’ Brad Griffin about artificial intelligence and machine learning as engineering aids for signal and power integrity optimization. Brad makes the case that artificial intelligence methods, when added to optimizing tools in the design flow, can help engineers to evaluate a larger number of potential solutions, and zero in on more highly optimized solutions than they may have found on their own.
IPC Design Competition Wrap-up
The IPC Design Competition took place during IPC APEX EXPO 2023, with five finalists competing—a far cry from the original 49 entries last fall. After the competition was over, we spoke with Kris Moyer, the IPC instructor who created the design used in the competition and served as a design advisor and judge for the event. We asked Kris to give us a quick wrap-up of the competition, as well as his thoughts on this year’s design, which none of the finalists completed.
Embedding Know-how Into Automation
Michael Ford, senior director of emerging industry strategy for Aegis Software, speaks with Barry Matties on the topic of tribal knowledge, its pros and cons, and its role in our industry. While it may be useful if your team never changes, the inevitability of a person’s career progression means they take their knowledge with them. Michael brings his nuanced perspective to the conversation.
Savita Ganjigatti: The Spark of Innovation
Savita Ganjigatti, vice president of engineering at Sienna ECAD Technologies, shares how her well-timed suggestion sparked the worldwide phenomenon that is the IPC PCB Design Competition, as well as how well-informed leaders are uniquely positioned to shape our industry’s future. Savita’s recipe for success? Work hard, read widely, and reframe problems as exciting possibilities for innovation.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Texans like to say that everything is bigger in Texas. That certainly seems to be the case for the SMTA Dallas Expo & Tech Forum. Publisher Barry Matties and I attended SMTA Dallas on Tuesday, and the tabletop show has now grown to 100 exhibitors, up from 92 vendors last year. It’s become more than a local or regional show, with some exhibitors flying in from Silicon Valley and the East Coast.
Material Matters and Tribal Knowledge
At a recent IPC Laminate/Prepreg Materials Subcommittee meeting, I made two observations: It was very well-chaired and managed, and despite a full attendance of very knowledgeable materials experts, none could remember the rationale for several of the specification sheet descriptions—slash sheets—that comprise IPC-4101E, “Specification for Base Materials for Rigid and Multilayer Printed Boards.”
True Experts Can Cite Their Sources
We’ve heard a lot lately about the need to identify tribal knowledge within our organizations. How do you know whether an “expert” is sharing documented knowledge or it’s just something they learned at their first job during the Carter administration? We asked IPC design instructor Kris Moyer to explain his process for separating the wheat from the chaff, so to speak, in design knowledge. As he points out, a true expert will not be afraid to cite the sources and data sets behind their arguments.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The captive shop used to be the rule, not the exception. Until outsourcing caught on, that is. North American captive shops went the way of the dodo bird, and the PCB market hasn’t been the same since. Even R&D went out the window, or offshore, if you want to be technical about it.
But Schweitzer Engineering Laboratories (SEL) is something of a wild card. The company recently opened a new captive facility in Idaho, and the industry is paying close attention.
Sarah Czaplewski-Campbell: Ready to Take Flight
Sarah Czaplewski-Campbell, a materials/product development engineer at IBM, shares her experiences as a young professional who has benefited from the guidance of seasoned mentors alongside her own unflagging drive to expand her industry knowledge. She offers poignant advice for prospective professionals, urging them to assertively seek out advice and experiences that will help them progress in their careers.
Runner-up Discusses IPC Design Competition
PCB designer Adam Thorvaldson of Innovex was a finalist in this year’s IPC Design Competition at IPC APEX EXPO. He came in second place in this final heat, which is quite a feat, considering that the contest started last fall with 49 contestants from around the globe. We asked Adam to share his thoughts on the competition, what it means to be one of the winners, and any ideas about improving the contest for 2024 in Anaheim.
ICT Seminar 2023 Review: Energy, Thermals, and Assistive Technology
Widely believed to be the traditional Centre of England, Meriden was a popular venue for a gathering of the UK printed circuit community this month. They braved the forecast of heavy snow for the Institute of Circuit Technology’s annual general meeting to learn about current developments and challenges in a thought-provoking technical seminar and to network with industry peers and contemporaries. Thankfully, the forecasted heavy snowfall did not reach Meriden until after the event; we only had a few flurries, although the weather caused considerable disruption elsewhere in the country.
IPC APEX EXPO 2023 Special Session: Advanced Packaging
The IPC APEX EXPO Special Session on Advanced Packaging this year attracted enormous interest, with Conference Room 2 at capacity long before the session began. Even with lots of extra seats squeezed around the edges, the session was standing room only for the just-in-time arrivals. IPC Chief Technology Officer Matt Kelly opened proceedings by introducing a distinguished panel of experts: Jan Vardaman, president and founder of TechSearch International; Sam Salama, CEO of Hyperion Technology; Matt Neely, director of process engineering at TTM Technologies; and Jim Fuller, VP of engineering technology at Sanmina.
With Tribal Knowledge, Trust but Verify
Tamara Jovanovic is a design engineer with Happiest Baby, a manufacturer of smart baby beds that alert parents if the infant needs attention and soothes the baby back to sleep. She also recently completed her master’s degree in electrical engineering by studying around her work schedule. Since Tamara has been absorbing new information from the halls of academia and her workplace, we asked for her thoughts on differentiating between tribal knowledge and documented fact. Is tribal knowledge a friend, foe, or a little of both?
Thomas Marktscheffel: Collaboratively Revitalizing the Industry
Thomas Marktscheffel, director of product management software solutions at ASMPT GmbH & Co. KG, reflects on the evolution of industry-wide standards and how his multidisciplinary approach to the development of CFX has been crucial to its success. With the advent of digitalization, cultivating a collaborative spirit is now more than ever an essential component of standards development. Patty Goldman recently spoke with Thomas about what this award mean to him
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
I try to not talk about the weather in this space, but this week I feel compelled. I’m based in the Pacific Northwest, and we’re relatively used to it being wet and rainy. But just south of us in California, the state has gone from what I read has been called the driest period in the West in the past 1,200 years to a right proper drenching. This week’s news cycle felt like one of those California-style “atmospheric rivers.” There was so much worthy reporting worthy that I was a bit overwhelmed in making my final selections. Suffice it to say that, this week, there is quite a bit of news that’s worth your time to read.
Shrinking Silicon, Growing Signal Integrity Challenges
What happens when die sizes shrink? As IPC design instructor Kris Moyer explains, quite a bit. Shrinking silicon can mean rising signal speed and rise times, and traditional PCB designers may find themselves dealing with problems formerly only seen by RF engineers. We asked Kris to discuss the pros and cons of silicon shrinkage and some of the techniques and trade-offs that PCB designers and design engineers need to understand as they find themselves entering the RF arena.
Are You Offering Options in Your Bill of Materials?
In this interview, Saline Lectronics (an Emerald EMS company) President Jason Sciberras talks about PCB designers offering packaging options in the bill of materials. As Jason explains, mil/aero manufacturers like Saline can’t make many changes to a design without getting recertified, so including approved packaging options in the BOM from the start is a great way to go. Are you offering options in your BOM?
Meet Henry Crandall: New IPC Student Board Member
Barry Matties sits down with Henry Crandall, the newly minted Student Board Member on the IPC Board of Directors, to talk about how Henry became the first PhD student in electrical engineering in his family, as well as how his role on the IPC Board will allow him to represent the voices of students and young professionals interested in shaping the future of both IPC and the industry.
A Week-long Industry Extravaganza
We were back in San Diego, maybe for a “long vacation,” as IPC APEX EXPO is in Anaheim next year. Before we get to Anaheim, though, let’s talk about the show: It was a great week. I spent Sunday and Monday visiting some excellent Professional Development courses. As you know, this is a fast-changing industry, and we have to keep learning to stay ahead. On Monday, I attended the Microvia Weak Interface/Reliability subcommittee, and on Tuesday, the Ultra-HDI Technology Committee.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s been a busy week in our industry. We have a duke’s mixture of news and columns in this week’s Editor’s Choice, starting off with some good news for the American electronics manufacturing industry. In his State of the Union speech, President Biden signaled his support for the CHIPS Act and the U.S. electronics industry, and he promised that Washington would put its money where its mouth is this time. Is it going to happen? Don’t bet the rent money.
Shrinking Silicon, EMI, and SI
Dr. Todd Hubing is a longtime EMC instructor, president of LearnEMC, and a professor emeritus of the Electrical and Computer Engineering program at Clemson University. I asked Todd to discuss the challenges that shrinking silicon can present for traditional PCB designers, as well as the opportunities and benefits of smaller chip features.
A First Look at IPC-CFX Box for Legacy Equipment
Although the prevalence of IPC-CFX in the electronics manufacturing industry has increased since the standard’s launch in spring 2019, the committee responsible for the standard has recognized legacy equipment in the field as a significant barrier to widespread industry adoption. To address this, an A-Team under the IPC-CFX Standard Task Group spent the past year working on a project that provides simple, readily available IPC-CFX hardware with supporting SDK that can act as an IPC-CFX endpoint for existing legacy equipment.
Alpha Takes the Greenfield Route
Alpha Circuit is a PCB fabricator located in Elmhurst, Illinois. Given that the launch of a new PCB fab is a rare occasion these days, we caught up with the senior team—Prashant Patel, president and CEO; Steve Smith, general manager; Steve Ryan, sales and direct support—guiding the buildout of Alpha Circuit’s brand new 44,000 square foot facility. They discuss what goes into equipment selection and line design, and the timing couldn’t have been better. At press time, the new facility was on schedule for test production by the end of January 2023.
A Post-show Marketing Plan
After you’ve exhibited at a trade show, then the work really begins. Where do you begin? How do you best capitalize on the leads and other contacts you’ve made? We asked Kiki Shimomae, sales and marketing coordinator for Taiyo, to discuss her pre- and post-show plans for a show like IPC APEX EXPO, and the importance of staying visible on social media.
EIPC Winter Conference 2023, Day 2 Review
Day 2 of the EIPC Winter Conference at the Groupama Stadium in the Décines-Charpieu region of the Metropolis of Lyon in eastern France included a privileged visit to the Bugey Nuclear Power Plant for those who were registered and passed their security clearance. Such was the interest that the party was split into morning and afternoon groups. EIPC board member Martyn Gaudion, CEO of Polar Instruments, made a fine job of moderating Session 6 twice over.
Another Successful STEM Outreach
The IPC Education Foundation (IPCEF) hosted its annual STEM Outreach Event over the course of two days at IPC APEX EXPO 2023 in San Diego, accommodating more than 550 students on Wednesday, Jan. 25 and Thursday, Jan. 26. This was IPCEF’s largest event to date. The event created awareness of the many careers available in the electronics manufacturing industry and helped future talent engage and connect with industry professionals.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, I used my super sleuthing skills to select news and articles that are both driven by numbers and themes. Let’s see if my selection matches up with yours. We know our readers are opening our daily and weekly newsletters, scanning the important news of the day. The numbers tell me that. But it’s the content within those clicks that help me lock in on a clear line of thought. This week, the topic of the week: investments.
Shrinking Geometries: Back to Fundamentals to Fight EMI
Dan Beeker is technical director at NXP Semiconductors, a veteran design engineer, and an instructor who has spent years helping students and customers battle EMI through building a better understanding of electromagnetic fields and field theory. In this interview, Dan explains what happens when silicon shrinks, how feature size controls signal speed, and why this marks the perfect time to return to the fundamentals of physics and field theory.
The Industry Is Back and Better Than Ever
To say that anticipation had been building prior to this show would be an understatement. Bearing in mind the various unknowns as we emerge from the worst of the pandemic, IPC APEX EXPO 2023 stood apart as a beacon of cautious optimism. Overall, I don’t think anyone left the show disappointed. There was a real air of resurgence on the show floor related to the many new technologies, innovations, materials, and Smart manufacturing solutions being developed in the industry.
Show & Tell Magazine: Reflecting on Another Unforgettable Year
There’s always a sense of heightened expectation as we prepare for another show, and then a bit of a collective sigh when it’s over—a sigh of relief, maybe, but mostly a sigh of contentment at another job well done. Thank you for a week of unforgettable memories. The close of the show also means it’s time for our annual Real Time with… Show & Tell Magazine, the only post-show guide you’ll need. Why? Because it isn’t just a comprehensive look at what happened at the show—it’s so much more. We have exclusive interviews with IPC award winners, thoughtful observations on the show from industry leaders, pages of image galleries, special STEM event coverage, and a complete listing of the nearly 80 Real Time with … interviews conducted and posted during the show.
Real Time with... IPC APEX EXPO 2023: We Can All Learn Something
Dylan Nguyen speaks with Charlene Gunter du Plessis, senior director, IPC Education Foundation, about careersinelectronics.com, a newly designed information-driven, industry-focused career website from the IPC Education Foundation.
Q&A With the IPC Design Competition Winner
Design engineer Sathishkumar Vijayakumar (aka Sathish Kumar V.) with Tessolve Semiconductor, India, took home top honors in this year’s IPC Design Competition, besting the other four finalists in a rigid-flex design showdown during IPC APEX EXPO. Unlike last year, no one finished the design completely, so judges graded competitors on what they did finish, as well as criteria such as design decisions they made, and whether they followed electrical and DFM rules.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, we published a variety of articles, columns, and news items. But let’s have a special round of applause for Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), two members of the House of Representatives who sent the DoD a letter detailing the need for more production of PCBs and IC substrates in the United States. Republicans and Democrats have been mixing like oil and water lately, so it’s promising to see these two reach across the aisle and try to get something accomplished for the greater good.
Real Time with... IPC APEX EXPO 2023: Overseas Production
David Bishop, south regional sales director at ICAPE Group, talks with Andy Shaughnessy about overseas production, specifically out of China, as they respond to customer demand.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We have new projects in the U.S. Army space programs, research on gold thickness and solderability, a call for papers throughout 2023 from SMTA, an investment in Korean facilities by ASM, and an adjustment in TTM’s assignation with the U.S. DoD. All together, these five must-reads represent the hurtling trajectory that R&D seems to be following in 2023.
Real Time with... IPC APEX EXPO 2023: Polar Driving Software Development for Customers
Andy Shaughnessy sits down with product specialist Erik Bateham, a new hire at Polar Instruments. Erik explains his circuitous route into circuit analysis tools. He also discusses the challenges that Polar’s customers are facing, and how user input drives Polar’s software development. If you were unable to attend IPC APEX EXPO 2023, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.
PCB Designers Are Really Product Designers
As I look back on 2022, I’m realizing that my company plays multiple roles in client projects beyond just designing circuits and PCBs. Sure, we’re primarily a PCB design company, but we also help with things that happen outside the PCB. This includes tasks like enclosure design, defining mechanical constraints, simulating electrical behavior, mating boards into larger assemblies, selecting cabling, and defining test requirements, all of which slowly creep into the standard scope of work for design projects.
Real Time with... IPC APEX EXPO 2023: Automotive Electrification
Nolan Johnson talks with Senior Product Manager Chris Nash of Indium Corporation, who discusses Durafuse LT, a novel solder paste mixed alloy system with highly versatile characteristics that enable energy savings, high-reliability, low-temperature, step soldering, and assemblies with large temperature gradients. It also provides superior drop shock performance to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
I-Connect007 Editor’s Choice: Five Must-Reads For the Week
It’s Feb. 3, 2023—2/3/23—and now we know the results of yesterday’s Groundhog weather forecast straight from Gobbler’s Knob in Pennsylvania. Punxsutawney Phil says six more weeks of winter. If you’re watching the ongoing ice storms blanketing much of the United States at present, that seems like a safe bet. Also a safe bet is that the most-read news this week is IPC APEX EXPO related. Additionally, this week IPC published its EMS and PCB numbers for December. All told, lots of industry news to read this week.
Real Time with... IPC APEX EXPO 2023: Wise Continues Expansion With Technica Partnership
Andy Shaughnessy sits down with Massimo Passerini, founder of Wise, and Technica's Jason Perry, to discuss Wise's latest PCB manufacturing automation. They also focus on the company's distributor partnership with Technica, which is moving into the PCB fab market. If you were unable to attend IPC APEX EXPO 2023, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.
DesignCon 2023 Opens With Strong Attendance
As George Costanza would say, “DesignCon is back, baby!” The show opened Wednesday morning, and it really felt like old times again. The aisles of the Santa Clara Convention Center were busy, and the classrooms for the technical conference were nearly full. And I spoke—or tried to speak—with quite a few engineers who spoke almost no English. That’s a good sign; in recent years, there were very few attendees from outside the U.S. because of Covid restrictions. The Pacific Rim is well represented this year.
Don't Blink: The IPC APEX EXPO Time-lapse
It’s a tradition here at I-Connect007 to set up a time-lapse for IPC APEX EXPO. There’s something satisfying, mesmerizing even, to watch the show floor build out and see the moment when the doors open and visitors fill the exhibit hall. Based on what others have said over the years, I know I’m not the only one whose favorite part is when the carpet gets rolled out and the whole character of the exhibition changes. This time lapse starts on the Saturday prior and continues through the Thursday tear-down phase.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, the IPC APEX EXPO event has cast a long shadow across the news feeds. No, that’s not the right metaphor. No, not a shadow; shadows are dark. It would be more accurate to say IPC APEX EXPO cast a beam of illumination upon the news feeds for the electronics manufacturing industry. To that end, the APEX EXPO news makes a prominent appearance in this week’s editor’s picks.
Advanced Packaging Means Advanced Routing Issues
In today’s ever-shrinking world of electronics designs, the use of BGA parts with very fine pitch features is becoming more prevalent. As these fine-pitch BGAs continue to increase in complexity and user I/O (number of balls), the difficulty of finding escape routes and fan-out patterns increases. Additionally, with the shrinking of silicon geometry leading to both smaller channel length and increased signal integrity issues, some of the traditional BGA escape routing techniques will require a revisit and/or adjustment to allow for not only successful fan-out, but also successful functioning of the circuitry of the BGA design.
Scaling Beyond Silicon
Technology has always invoked radical changes, but unlike today, there used to be one major revolutionizing technology trend at a time. The world is becoming increasingly connected, more automated and more intelligent, driven by generational drivers—hyperscale computing, 5G, artificial intelligence and machine learning (AI/ML), industrial IoT (IIoT), and autonomous vehicles—which are invoking disruptive technological forces on vertical markets, unfolding varied levels of microelectronics and digital transformation across the globe. The increasing demand for miniaturization and higher speed is changing the dynamics of the semiconductor components needed to store and process data.
Bright Lights, Big City: STEM Event Kicks Off
The San Diego sun was warm and bright on Wednesday afternoon, but it didn’t stop the crowds from filling the aisles at IPC APEX EXPO 2023 for the trade show’s second official day. Technical conferences, professional development courses, and a keynote from IPC President and CEO John W. Mitchell kept attendees busy. But the real highlight of the day was upstairs where approximately 300 high school students from the local San Diego area rode buses to the San Diego Convention Center for a day full of activities meant especially for them.
IPC APEX EXPO 2023: Face-to-Face Not Mask-to-Mask
It was a bright, sunny California day as IPC APEX EXPO officially opened its doors on Tuesday, Jan. 24 at the San Diego Convention Center. The Technical Conference began on the same day, while the program of standards meetings and professional development courses had been in progress since Saturday, Jan. 21. During the hustle and bustle of the show build-up over the weekend, it was clear to see that so many exhibitors had the confidence to bring so much major equipment and to invest in such spectacular booths to display it.
A Challenge Facing Aerospace Designers In 2023
As the aerospace industry has been tasked with fitting increasingly complex electronics in existing airframes the demands on PCB substrates have begun to overtask the existing state of the art in PCB fabrication. Recently, I was called in to troubleshoot some reliability problems with a very dense PCB that had components on both sides and required the use of stacked blind vias and buried vias. The usual name for this kind of design is “build-up fabrication,” requiring many trips through the lamination, drilling, and plating operations at a fabricator.
Monday Recap: Optimism and Economics at IPC APEX EXPO
It was a packed house for two large events at IPC APEX EXPO 2023 on Monday, Jan. 23, as the EMS Leadership Summit was wrapped in the pale veil of caution, meanwhile hundreds more gathered to hear from IPC’s chief economist, Shawn DuBravac. At the EMS summit, the morning presenters from IPC all shared silver linings they saw inside the fading clouds of uncertainty.
It’s Here: The Launch of IPC Community Magazine
IPC Community Magazine launches today at IPC APEX EXPO 2023, both in digital and print form. It is now widely available for download at no cost. This magazine helps tell the stories of IPC, particularly for IPC members who use and interact with the trade organization. IPC worked closely with I-Connect007 (IPC Publishing Group) to develop the concept for the publication, and asked John W. Mitchell, president and CEO of IPC, to share a few thoughts as he looked at the magazine for the first time in print.
Classes and Meetings Under Way at IPC APEX EXPO
IPC APEX EXPO 2023 doesn’t officially kick off until Tuesday, but there’s plenty of action going on here at the San Diego Convention Center. Booths are sprouting up on the show floor, and exhibitors are starting to arrive. Upstairs, committee meetings have been taking place all weekend; the IPC-J-STD-001 and IPC-A-610 Joint Task Group, and IPC-A-600 and IPC-6012 Joint Task Group meetings, were abuzz with activity. The Professional Development classes began on Sunday, covering everything from design through assembly processes, flex and rigid-flex, and technologies of the future.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We’re in the middle of show season, and it certainly “shows.” Thank you very much. I’m here all week. Don’t forget to tip your wait staff. This week, we published a variety of articles, columns, and news items, and much of it centered on trade shows. Technical Editor Dan Feinberg brings us a report from CES 2023. IPC announced the winners of the Best Technical Paper awards for IPC APEX EXPO 2023. And we have an interview with Altium’s Rea Callender about the company’s educational efforts at APEX and around the globe.
Setting Expectations for IPC APEX EXPO's Women in Electronics Reception
Emily Calandrelli, IPC APEX EXPO’s opening keynote speaker and featured speaker of our Women in Electronics Reception, is an MIT-engineer turned Emmy-nominated science TV host. She’s the host and co-executive producer of “Emily’s Wonder Lab” on Netflix, she's featured as a correspondent on Netflix’s “Bill Nye Saves the World” and an executive producer and host of FOX's “Xploration Outer Space.”
Altium Focuses on Design Education
Altium keeps its eyes on the designers of the future. The company has been working with colleges and universities for years, providing free seats of Altium Designer for the next generation of PCB designers and design engineers. At IPC APEX EXPO 2023, Altium will be providing software for the finalists in the IPC Design Competition just as it did last year. They offer a variety of other educational programs as well, including Upverter classes and a design competition that aims to address environmental change. Here, Rea Callender, Altium’s VP of education, discusses its educational programs and plans for the week of the show.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
“New year, new you.” That tagline seems to be everywhere right now. All five must-reads this week reflect this theme. Does this apply to you and your company? We have quite a duke’s mixture of articles. We’ve got AT&S outlining their market position on advanced packaging, and Auburn University doing research on smart manufacturing processes. Keysight is coordinating practical 6G research in Europe, Technica shares where they see the market growing, and SEMI adds new members to a key board responsible for market guidance. These five stories drew a lot of reader attention this week.
The Battle of the Boards
Last year, IPC held its first-ever design competition at IPC APEX EXPO in San Diego. PCB designers from around the world competed in a series of heats during the months before the show, culminating in a showdown on the show floor between the top three finalists. Rafal Przeslawski, now with AMD, took home the top prize last year. This year, the competition is back for its sophomore year. I asked Patrick Crawford, manager of design standards and related programs for IPC, to “layout” the details on the design contest, including lessons learned in 2022 and what’s new for the 2023 competition.
Shawn Dubravac: What’s New in Tech
As the world grapples with issues like climate change, consumers and manufacturers are increasingly looking for ways to reduce environmental impact. This has led to a focus on fostering innovation in sustainable materials, renewable energy sources, and recyclable components. One example is CarbonX, a new carbon material composed of nano-sized carbon filaments that could help tire makers meet the increasing demand for sustainability. Technology will play a pivotal role in this transformation and one sector set to see tremendous change is the auto industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The youngsters are back in school, and we’re all back to work. The water is back on for most of us in Atlanta; when temps dropped down to 8 degrees Fahrenheit, our pipes started bursting left and right. After a Christmas dinner with no water, I have a new appreciation for H2O. It’s been a busy week, and we published a variety of articles, columns, and news items. In this week’s top five, we have news about the market in Southeast Asia, a look at what the CHIPS Act really entails, a deep dive into CMMC, and a peek at how printed electronics developers are using flexible circuit concepts to facilitate PEC. We also say goodbye to a Top Gun PCB designer who left us way too soon.
ICAPE: Solutions With No Limits
Over the past five years, ICAPE Group has strongly focused on analyzing the complex needs of the market to provide worldwide solutions for customers whose needs range from simple to very complex technologies. The services provider has done this by putting offices in key strategic locations—particularly China—with staff that understand the nuances of language and culture. These types of decisions make an important difference when it comes to getting customers exactly what, and when, they need it. Yann Duigou, CMO, and Bingling Li Sellam, VP of Northern Europe, share their secrets for success.
Where Exactly is the Signal?
When I first got involved in printed circuit board design in the early 1990s, fast rise/fall times were just starting to become an issue. Prior to that we had been pretty much a “connect-the-dots” kind of technology. But as rise times got faster, it became necessary to worry about (electromagnetic) fields. One manifestation of that was EMI, and the increasing need to pass FTC compliance testing.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
Just because it’s a holiday week doesn’t mean the news is slow. Okay, maybe a little bit slower than normal, but “slower” can also be the same as “fast, just less fast.” We’re going a bit deeper into the list for our must-reads looking for high-impact hard news. I mean, you’ve all read the curated stuff already, no sense rehashing that. In fact, I’ll even throw in a bonus news item just because there was some good stuff this week. Have a great New Year’s weekend.
'Happy New Year' Celebrations Around the World
New Year’s Eve is tomorrow, and 2023 is around the corner. Where did the time go? That’s the $64,000 question. We celebrate New Year’s Day, in part, to help us mark the passage of time—sort of a shared experience for the human race. Humans have been celebrating New Year’s Day for thousands of years, but the party really took off in 45 BC, after Julius Caesar revamped the Roman calendar. From that point until the middle of the 18th century, New Year’s Day in Europe fell on a variety of days, including Dec. 25, March 1, and March 25. Andy Shaughnessy gives us the details.
Happy Holden on Gerry Partida’s ‘Significant’ Microvia Reliabilty Paper
Gerry Partida, vice president of technology at Summit Interconnect, authored a technical paper, “Next Progression in Microvia Reliability Validation—Reflow Simulation of a PCB Design Attributes and Material Structural Properties During the PCB Design Process,” at IPC APEX EXPO 2022, and it’s worth revisiting. This significant paper on microvia reliability validation provides a summary of what’s been happening in the microvia fabrication arena, especially regarding the issue of latent defects in stacked microvias.
A Sneak Peak with Jim van den Hogen
Jim van den Hogen has been teaching PCB designers and design engineers about fabrication processes for decades. Twenty years ago, I had the opportunity to see a class of his at PCB West; even back then, the room was jammed with designers eager to learn more about DFM techniques. Now Jim is bringing his teaching expertise to IPC APEX EXPO 2023 this January with a similar class directed at PCB designers. I asked Jim to give us a sneak peek into his curriculum and to share what he hopes attendees will take away from his class, as well as his thoughts on how to best bridge the gap between design and fabrication.
Designing a Sustainable Future
While it may be traditionally considered a PCB fab and assembly show, IPC APEX EXPO is quickly becoming a destination for PCB designers and design engineers. Flipping through this year’s schedule, I counted 15 Professional Development and Technical Conference classes that focus on PCB design, as well as several fabrication classes that many of you should probably take. I checked in with Carlos Plaza, IPC’s senior director of educational development, to discuss the organization’s drive to present more PCB design curriculum at the upcoming show and how the show can give designers the tools they need to overcome the many challenges currently facing the industry.
The Five Most-read Design007 News of 2022
Each December, we like to look back at the most popular articles of the past 12 months. You never know which article is going to blow up like a Harry Styles album. So, grab some leftover ham and hang out with us for a while. For your holiday enjoyment, here’s a blast from the past: the top five most-read Design007 articles of 2022.
The Five Most-read Design007 Articles of 2022
Each December, we like to look back at the most popular articles of the past 12 months. You never know which article is going to blow up like a Blake Shelton album. So, put on your ugliest holiday sweater and prop up that iPad. For your holiday enjoyment, here’s a blast from the past: the top five most-read Design007 articles of 2022.
The Most-read I-Connect007 Articles of 2022
Each December, we like to look back at the most popular articles of the past 12 months. You never know which article is going to blow up like an Avril Lavigne album. So, grab a cup of eggnog and curl up by the fire! For your holiday enjoyment, here’s a blast from the past: the top five most-read I-Connect007 articles of 2022.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
In this week leading up to Christmas, we have a little bit of everything. Pete Starkey has a review of the most recent EIPC Technical Snapshot, while Tom Kastner discusses the dwindling number of PCB companies in North America. Are we really down to 170 companies? IPC reports that North American PCB sales up 26.1% in November YOY, and the book-to-bill is dead-on at 1.00. Cybord CEO Zeev Efrat explains how his company can provide 100% component inspection. And I have an interview with a student I ran into at PCB Carolina who is working toward his “dream job” on being a technician. As Alex Barile says, he’d hate to work at a desk all day; he likes to install equipment.
Workflow Challenges in Fabrication
Paul Cooke, the senior director of business development for Ventec International Group, is presenting a class at IPC APEX EXPO 2023 that looks at workflow challenges in fabrication, and the myriad drivers that can affect yield, reliability, and cost. Here he discusses the details of this Professional Development course, what he hopes attendees will take away, and why designers and design engineers would benefit from this class.
PCB Carolina: Alex Barile Studying for His Dream Job
Visitors jammed the aisles at PCB Carolina, but I noticed someone who stood out from the crowd: Alex Barile, a student at Wake Tech, a community college in North Carolina. Alex loves the physical and mechanical aspects of machinery, but learned pretty quickly he doesn’t want to be sitting behind a desk all day. He’s found a major that fits both his personality type and professional interests.
Physics, Electrical Engineering, and PCB Design
When I was a sophomore in college, I had an amazing professor for Physics II: Electricity and Magnetism. He made a series of complex topics fun to learn, and his personality and way of teaching were almost tailor-made for the way I like to learn. He explained new concepts through practical examples, and always kept students engaged throughout the class, making sure everyone understood the lectures. Physics II was an engineering prerequisite, and I didn’t mind taking the class since I really enjoyed the material. However, I did find myself wondering a few times, “Will I ever use any physics in real life?” It turns out that the answer to the question was yes.
Tim Haag Celebrates 10 Years as a Columnist
I ran into columnist Tim Haag at PCB West, who was visiting the show with co-workers from the technical writing company First Page Sage. We discussed Tim’s years as a Design007 Magazine columnist, and some of the drivers affecting the technical writing market, such as the retirement of many PCB subject matter experts who were also go-to writers within their companies.
The First India Pavilion
For the first time, IPC APEX EXPO will host an “India Pavilion,” showcasing 16 Indian companies promoting India’s electronics manufacturing capabilities. The initiative was undertaken by the Ministry of Commerce & Industry, Government of India, and implemented by the Indian government agency, Electronics and Computer Software Export Promotion Council (ESC) India.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The holiday season is in full swing for most of us; no matter which holiday you choose to recognize here in the second half of December, it’s almost certain that your routine has some level of interruption to it right now. Chances are, you might not be consuming as much of your usual diet of industry news and information, what with all the holiday treats and traditional meals to be consumed instead. That, gentle reader, is why we bring you this week’s Top 5 editor’s picks–your slimmed down version of the news, leaving you more time for the other delights of the season. So without further ado, we bring you the five news items you really should make room for this week.
NCAB Creating a New Culture of Success
NCAB has been one of the most active companies in the industry when it comes to growth through acquisition, building an extensive global network over time. During the electronica show in Munich recently, Nolan Johnson met up with Greg Nicol and David Grant, both managing directors with NCAB’s UK organization. Greg and David had number of interesting insights on NCAB to share.
A New Gathering Place for Designers
IPC APEX EXPO started out as a show for the PCB manufacturing community, but it’s grown beyond that. This year, there’s more design curriculum at the show in San Diego than ever before. IPC instructor Kris Moyer has been instrumental in leading the organization’s efforts around PCB design and design engineering curriculum. So, I asked him the million-dollar question.
Industry Innovation Starts Here
If it isn’t clear already, your money, time, and effort will be well spent attending IPC APEX EXPO in January. Here, we’ve outlined the top six reasons that this event will be the highlight of your year. We’ve done all we can to make the event not only memorable, but a show that allows you to connect with industry peers, learn how to enhance your skills, help advance the industry, and discover new insights on products and strategies from industry innovators.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We’re into December, and the new year is around the corner. Things are looking pretty good for our industry. Trade show attendance is back up to pre-COVID levels, and a lot of companies are having banner years. Has the virtual trade show gone the way of the dodo bird? Let’s hope! This week, our must-reads include articles and news items on the decline of R&D, STEM education for kids, why vias do not heat up, the need for more DFT, and the lack of movement toward intelligent data transfer. Designers just love their Gerbers, but Dana Korf has a few ideas about how to make Gerbers obsolete.
Polar Instruments: Simulating PCB Potentialities
Nolan Johnson checks in with Polar’s Martyn Gaudion on the evolving needs of global PCB manufacturing markets in a post-pandemic world, where generating accurate PCB specification documentation is essential to successfully navigating today's rampant supply chain constraints. Polar has positioned itself to meet these needs through agile software product developments that allow OEMs and fabricators to simulate material interactions and end-product specifications, including in-demand features like a comprehensive "structure view" that allows users to visualize all the transmission lines on a given a PCB. Though keeping pace with the demands of a rapidly growing industry has been challenging, Polar's commitment to innovation has kept its software suite ahead of the curve.
The Test Connection: Spreading the Word About DFT
As signal speeds continue to increase and feature sizes decrease, PCB designers are beginning to pay greater attention to test and design for test (DFT) strategies. Bert Horner, president of The Test Connection in Hunt Valley, Maryland, is spearheading this drive to show designers the benefits of a solid DFT plan, as well as the downside of not having a test strategy. I met with Bert at PCB Carolina, where he was exhibiting and presenting a paper during the conference. We discussed his presentation, as well as why designers need to understand test and DFT issues, and why we need to see the PCB as one small—but very important—part of the entire system.
Electronics vs. Physics: Why Vias Don’t Get Hot
Most of are aware that when we pass an electrical current through a trace (conductor), the trace will heat up. This temperature increase is caused by the I2R power loss dissipated in the resistance of the trace. The resistance of a copper trace is mostly determined by its geometry (cross-sectional area), and there are lots of studies trying to look at the relationship between the current down a trace (of known size) and the resulting temperature of the trace. But the situation is much more complicated than this. There are physical properties that exist that result in helping to cool the trace. These properties are usually a combination of conduction of the heat away from the trace through the material, convection of the heat away from the trace through the air, and radiation of the heat away from the trace.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.
Randy Faucette Discusses PCB Carolina’s Explosive Growth
One of the fastest-growing tabletop shows is PCB Carolina, which is held at NC State University in Raleigh. Each year, the show draws more exhibitors than the venue hall can hold, pushing some exhibitors out into the lobby. And this year, the number of registered attendees broke the 1,000 mark for the first time. At PCB Carolina, I spoke with Randy Faucette, the founder of the Research Triangle Park design bureau Better Boards, which organizes this annual tradeshow and conference, and I asked him to share the secret to this show’s expansion.
An Opportunity to Give Thanks
I-Connect007 wants to take this opportunity to give thanks to so many people that make "the magic" happen day in and day out. Thanksgiving is a time, of course, to give thanks for the bounty that we enjoy, and that couldn't be truer each day for the support we receive in editorial, advertising, and marketing of our daily, weekly, and monthly publications. It's a pleasure to contribute to the industry—and to receive contributions. Read our Thanksgiving message and then enjoy your turkey day.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We’re heading into the holiday season, and tradeshow season is in full swing. Managing Editor Nolan Johnson and technical editor Pete Starkey have spent the week in Munich covering electronica, and apparently the attendance was wunderbar. COVID still persists, but everyone is ready to return to some normalcy. There’s a lot going on in our industry. In this week’s roundup, we have articles on everything from rigid-flex to the supply chain, as well as a primer on the role of physics in PCB design. As we move into the new year, you should check out this Top 10 list of tech trends for 2023, courtesy of Gartner.
The Physics of PCB Design
In this wide-ranging interview, Dr. Eric Bogatin discusses the relationship between physics and electrical theory, and why it’s critical for designers and design engineers to understand the laws of physics. As he points out, the math is important, but designers shouldn’t let the principles of physics “hide behind the math.” Eric discusses some points of physics that designers need to understand, the physics resources available, and why it’s so important to have some understanding of Maxwell’s equations, even if you don’t have a strong math background.
DownStream Flexes in Rigid-Flex
During PCB West, I caught up with DownStream Technologies co-founder Joe Clark and Senior Product Marketing Manager Mark Gallant. We discussed some of their latest tool updates, including a greater focus on bringing post-processing functionality, such as inter-layer analysis capability, to rigid-flex circuits. Joe also offered a look at global design trends going into 2023, as more engineers take on PCB designer roles while senior designers are retiring.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The industry news cycle seems to be picking up speed lately. Of course, 30 days into the quarter is about when public companies announce their results, and in the midst of this worldwide financial situation, we’ve got all eyes on anything coming out from our counterparts in the industry. I’ve noticed that global corporate results (Nan Ya PCB and TTM, in particular) do seem to be on everyone’s radar. In addition to financial news, trade shows are popping back up around the world—Europe, India, and a special report from editor Andy Shaughnessy, who took his own road trip to Raleigh, reporting on PCB Carolina, which had its own heyday this year.
PCB Carolina Breaks Attendance Record
PCB Carolina has been growing consistently for the past decade, and this year the show reached a milestone: more than 1,000 attendees. Yesterday, the show was the busiest I’ve ever seen it; I almost had to park off the NC State University campus. Fortunately, I’m an expert at “the parking lot game.” I waited until a guy was leaving and then I sniped his spot. Bam!
IPC to Unveil New Member Magazine, ‘IPC Community’ at IPC APEX EXPO 2023
IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.
The Printed Electronics Roundtable, Part 3
We recently conducted a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies.
In this third and final installment of the roundtable, these experts discuss some of the differences and similarities between PEC and traditional PCB processes, the future of printed electronic circuits, and why the best way to learn about this technology is through networking with veterans of this segment who are eager to share their expertise with the next generation.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Halloween is next Monday and parties will be taking place over the weekend, I’m sure. Here in the United States, at least, the “any-holiday-is-an-excuse-for-a-party” crowd has integrated Halloween, along with Valentine’s Day, St. Patrick’s Day, and Cinco de Mayo into wide-ranging opportunities for themed revelry. The news this week has been a bit crazy as well, though certainly not alcohol-fueled. There was a lot of important news and narrowing it down to just five was thought-provoking yet ultimately rewarding. Here then, are the five top pieces of news you shouldn’t miss this week.
HDI, A-SAP and mSAP: A Designer’s Point of View
HDI—high-density interconnect—designs require some different thinking on the part of the designer. One of the first things to consider is whether you need HDI, and if so, how much. The HDI option comes into play as soon as you purchase any components with 0.5 mm pin pitch. The number of these components and other specifications of your design will determine the amount of HDI you will need. Here’s a quick list of HDI options.
Forming Standards for Ultra HDI
To get the latest news about ultra high-density interconnections (UHDI), we checked in with Jan Pedersen, NCAB Group’s director of technology. Jan is co-chair of IPC D-33AP, and a great source of overall DFM expertise as well. We asked him to give us a snapshot of UHDI in the industry, where we’re headed, and what this means to PCB designers.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Where did the year go? I can’t believe we’re planning our January and February issues now. It was 84 degrees most of last week in Atlanta, and now it’s 31. I guess I should take my Hawaiian shirts out of rotation! This week we have quite a variety of articles for you. It’s officially show time and the industry is back in business in a major way. We have some news coming out of last week’s advanced packaging event in Washington, D.C., and an article about navigating SMTA International, which opens on Halloween this year in Minneapolis. We have a great column on avoiding EMI with good routing strategies, and an article on electrically conductive inks. To top it off, I-Connect007 has published a new book, written by Matt Stevenson of Sunstone Circuits, that posits a new “design for”: Designing for Reality. If you’re a designer, isn’t designing for reality what it’s all about?
EMA Helps Ease Designers’ Supply Chain Woes
Supply chain issues are continuing to cause disruptions in our industry, though lead times have dropped from astronomical to merely troublesome. In this interview, Chris Banton, EMA Design Automation’s director of marketing, explains how Cadence’s software has evolved as designers’ needs have changed in the past few turbulent years, including providing designers with component availability data early in the process.
Q&A: The Learning Curve for Ultra HDI
For this issue on ultra HDI, we reached out to Tara Dunn at Averatek with some specific questions about how she defines UDHI, more about the company’s patented semi-additive process, and what really sets ultra HDI apart from everything else. Do designers want to learn a new technology? What about fabricators? We hope this interview answers some of those questions that you may be having about these capabilities and what it could mean for your designs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.
Ultra HDI Primer
We recently spoke with Herb Snogren, an industry veteran and consultant with Summit Interconnect tasked with leading the company’s ultra HDI efforts. Herb is co-chair of the IPC ultra HDI subcommittee, IPC D-33-AP. In this interview, Herb discusses the current state of UHDI, how designers and fabricators can get started working in this new frontier, and why the U.S. must invest in UHDI technology now to counteract Asia’s near dominance of the UHDI segment, which has left some of our critical industries vulnerable to supply chain disruptions.
Microvias Can Be Stacked in Certain Package Densities
Summit Interconnect’s Gerry Partida recently spoke with the I-Connect007 Editorial Team about his research into root causes of weak microvias. Rather than a single manufacturing process cause, Gerry suggests that microvia reliability is the culmination of several material interactions and that contrary to popular belief, microvias can still be stacked in small, tight packaging densities. He highlights the need for simulation, as well as some of his findings that he plans to publish in a paper at IPC APEX EXPO 2023.
IPC Symposium: U.S. Must Address Critical Gaps in Advanced Packaging Needs
There is a significant capability gap in advanced substrate packaging in North America, forcing all semiconductors to be packaged in Asia and leaving North America at risk in its supply chain. This was a common theme during a two-day IPC Advanced Packaging Symposium, which launched yesterday at the Kimpton Monaco hotel in Washington, D.C.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s been a busy week for I-Connect007. Managing Editor Nolan Johnson and I covered PCB West at the Santa Clara Convention Center, and, as you’ll see in my article below the place was packed. We have an article about SMTA International, scheduled for the end of October. I think the trade show season is looking good into 2023. People are done with COVID shutdowns and ready to get back to live trade shows and conferences. We’ll be in Minneapolis to bring you the latest news and technical information. We also have a news report about the European Union committing to craft its own version of America’s CHIPS Act. There’s a great interview with Dana Korf and John Strubbe about the latest innovations in materials at TUC. And columnist Paige Fiet explains why she is committed to making manufacturing “cool” again to help recruit and retain young technologists.
From the Floor at PCB West 2022
Though the organizers of PCB West had soldiered through in delivering a conference every year during the pandemic, the virtual and hybrid models just did not quite meet the requirements for a technical conference. To be fair, the limitations weren’t PCB West’s fault; the shortcomings came from the show’s virtual environments, not the host. All the more encouraging, then, that the 2022 edition of PCB West was back in bloom.
Book Excerpt: 'An Introduction to The Printed Circuit Designer’s Guide to… Stackups'
To give readers a sample of 'The Printed Circuit Designer’s Guide to... Stackups—The Design within the Design,' by Bill Hargin, we are providing the book's introduction. He writes, "Another book about stackups? If you’re asking this question, I’d like to know the book you’re thinking of, as I was looking for it a few years back. I have a pretty good PCB signal integrity (SI) library, and I’ve only found one chapter on stackup design so far."
The Chip Shortage Leads to Innovation
The chip shortage is by no means over, with estimates expecting it will last into 2023. Some could see it taking even longer, such as Intel CEO Pat Gelsinger, who expects it to see shortages into 2024 due to those now impacting electronics production equipment. But if there’s any bright spot to be had, it’s that a crisis often leads to long-term solutions. In this case, it’s the increase in government funding for semiconductor production in the United States. Once the CHIPS Act proceeds, we can significantly accelerate building semiconductor fabs in the United States and work toward preventing future chip shortages that would put us back into our current situation.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, our five must-reads include the IPC report on the EMS industry and a report on ICs for the automotive market. Add to that Lockheed’s highest powered DoD laser yet, IPC’s APEX keynote announcement, and—for you conference and expo junkies—a calendar of upcoming industry events. I can’t help but notice that much of our news is about, well, something new. In this case, my editor’s picks for the week capture new technology, new perspectives, new ways to communicate content, and new developments that we can expect to see in our future daily life. To borrow a phrase from the TV show “Firefly,” everything is “shiny” this week. I will be at PCB West, the IPC Advanced Packaging symposium, SMTA International, and electronica. If you see me, say hello, and share something cool about the part of the industry you’re in.
DFM 101: Final Finishes—ENEPIG and IAg
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability. Final finishes provide a surface for the component assembler to either solder, wire bond, or conductively attach a component pad or lead to a pad, hole, or area of a PCB. The other use for a final finish is to provide a known contact resistance and life cycle for connectors, keys, or switches. The primary purpose of a final finish is to create electrical and thermal continuity with a surface of the PCB.
Catching Up With John Johnson, New Director of Business Development at ASC
It’s always good to catch up with old friends, especially when you can start working together. I recently spoke with my friend John Johnson, who has joined American Standard Circuits as the director of business development. At ASC, John will be using the Averatek A-SAP process that he was previously involved with. He shares some of his background and provides insight on the best ways to use this semi-additive PCB fabrication process that opens the capability window for forming trace and space.
Some Relief, But Hold Off on the Party
To help PCB designers and design engineers get a clearer picture of the stress points in the industry, particularly from a company that deals directly with EMS providers, we reached out to CalcuQuote CEO Chintan Sutaria with a list of questions. The following Q&A explores trends in the PCB supply chain and heady advice for dealing with long lead times and counterfeit parts.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s officially fall now, and in Atlanta the temperature has plummeted to the mid-80s. We’ve all bumped our air conditioners up to 74 degrees. That means it’s trade show season, and I’ve been busy looking for my suitcase. This week, we have an assortment of news about associations, education, and advocacy, as well as another installment of our Printed Electronics Roundtable. And if you’re looking for a job, you are in luck; our jobConnect007 section is chock-full of open positions at all levels in this industry.
Pack Your Bags! We’ve Got Your Trade Show Calendar Here
It’s officially fall, and that means it's time to start planning your trade show attendance. To help you make decisions about when and where to go, we’ve put together a list of industry trade shows. It has been two long years with no or few in-person trade shows, and we’ve felt it. So, now we’re back in business and ready to hit the road. Do you have a show or conference to add to our list? Let us know!
Part 2: The Printed Electronics Roundtable
We recently held a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies. In the first part of this roundtable, the team dispelled a variety of myths surrounding PEC. In this second part of the roundtable, the participants discuss what designers and fabricators need to know to jump into printed electronics, and some of the drivers behind this growing technology.
IPC: Companies Are Intentional About Tracking Environmental and Social Risks
Leading companies in the electronics manufacturing industry are highly intentional about their environmental, social and governance (ESG) priorities, with climate change and energy use among the most closely scrutinized issues, an IPC analysis shows. As part of IPC’s ESG for Electronics initiative, IPC is interested in developing resources for members on the most common ESG methods and priorities of leading companies across the electronics value chain. In support of this, IPC has preliminarily analyzed the ESG reports of approximately a dozen companies in selected portions of the industry.
A New Sourcing Paradigm
We’ve seen many changes over the past few years, and nowhere are they more evident than in the world of sourcing components. Sourcing has become one of the biggest challenges facing PCB designers and design engineers today. Gone are the days of procuring parts from a single source, and communication between stakeholders and distributors is critical. But as we learned in a conversation with I-Connect007 columnist Kelly Dack, PCB designers can use certain layout strategies to plan for the unexpected, such as leaving extra real estate so that smaller components can be replaced by larger, readily available parts if the originals become “unobtainium.”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
“You are the average of the five people that you spend the most time with.” This saying is attributed to Jim Rohn, and I couldn’t help thinking of that quote as I put together this week’s listings. Hear me out: 1) There are five items on our list; 2) These items zoomed to the top based on reader interest; 3) Every single one of these news items has an “association” association—IPC, iNEMI, SMTA, and NextFlex are all represented in what you, dear reader, chose to explore this last week.
Altium’s EDDI Report Tracks Components’ Availability—Today and Historically
There’s one lesson that all designers have learned over the past few years: Components might be here today and gone tomorrow, so tracking your parts is more important than ever. Any resources that help you keep tabs on your required parts are invaluable in these days of 40-week lead times. Earlier this year, Altium released one such resource: the Electronic Design to Delivery Index (EDDI) report. Assembled from millions of bytes of data gleaned from the Octopart search engineer and the Nexar platform, the monthly EDDI report provides part availability histories going back years, as well as a real-time snapshot of global inventories.
Designing Through Supply Chain Pain
Engineers are accustomed to the demanding challenges of designing for miniaturization, cost reduction, cross platform compatibility, and harsh environments. What has proven to be the most painful experience of my career (and for many of my colleagues) is the sheer lack of components from which to build our designs. Development cycles—commercial, industrial, medical, avionics—have been severely impacted, from large enterprise corporations to small design/integration companies. Awareness of the situation is the first step to understanding the underlying problems faced by today’s design engineers industry wide. Here are a few of the situations I have faced in the last year alone.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It feels like the first day of school. It’s September, and we’re all officially back at our desks, workstations, or kitchen tables. Even Les Vacances is over. Oui, c’est vrai! But instead of facing new teachers, we have to deal with diverse market forces, supply chain issues, and technology that never seems to stop evolving. Of course, that’s what makes this industry so interesting, isn’t it?
Ventec Thermal Management Book Excerpt: Chapter 1
Regarding basic principles of thermal dissipation there are three ways of dissipating energy: Conduction, convection, and radiation. The integrated metal substrate (IMS) printed circuit boards rely predominantly on heat conduction all the way through the different layers of the substrates from a hot point (the base of the component) to a cold point (the furthest surface of the metal base) and, usually, thereafter, through a dissipator.
Material Conservation: The PCB Designer's Role
During these times of supply chain uncertainty, many product developers are considering new ways to conserve materials—from laminates to components, layer reduction, and everything in between. Barry Matties and Happy Holden recently spoke with Alun Morgan, president of EIPC and technology ambassador for Ventec, about material conservation strategies for today’s PCB designers and design engineers. Alun explained why this may be the perfect time to educate PCB designers about conserving materials: When a model is broken, the people involved are much more open to new ideas.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week we have quite a variety of articles for you. There has been so much electronics industry news coming out of Washington, D.C., that it can be hard to keep track of what’s going on. So, Editor Michelle Te compiled a handy-dandy reference guide to recent legislation news, including our exclusive coverage. We need to keep an eye on these senators and representatives. They’ve been talking about the importance of our industry for the past year, but this is an election year, after all. They’ve been known to say one thing and do another.
I-Connect007 eBook Introduction: The Evolving NPI Process
Thanks to marketing and advances in technology, we have all come to expect that the electronic products we buy will be closely aligned to our individual and specific lifestyle or business requirements. This expected variability, in personal function and style, as well as regulatory compliance and a changing global economic landscape, has made designing and producing new products a challenging prospect. And, on top of the resulting “high-mix, low-volume” production cycles, increasingly more products contain electronic components in varying levels that heighten the complexity of design and manufacturing.
Design Tips for Lowering Costs of Fab and Assembly
This is the million-dollar question of every project: How can I cut the cost of the PCB? There are about a thousand answers to this question. There are a few simple guidelines that everyone can follow to reduce costs. I talk about them in my IPC CID and CID+ courses. Designers, fabricators, and assemblers talk about them in a variety of articles. Some professionals who have published some great articles on cost-saving strategies include Tara Dunn, Happy Holden, Chris Church, Kella Knack, Judy Warner, Julie Ellis, Lars Wallin, and many, many others.
Happy’s Design Tips for Material Conservation
For this issue, Happy Holden provided a range of options for designers who are seeking to conserve materials in their next design. He also offered an example of the relative cost index, or RCI, that he developed at HP exclusively for PCB design. With this RCI, designers can figure out the relative cost of a new design compared to an eight-layer through-hole board. We hope you can use this handy formula on your next design job.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Can it be Friday already? Seems like I’ve just barely put away my Tuesday dishes. Some weeks, I wonder where my days went as they fly by so fast I hardly even realize it. As I looked back through the news for the week, it was clear why everything went so fast: There was a lot going on. The news this week had a nice feel to it. It seems like the industry is starting to gain some traction again with shows, mergers and acquisitions, and companies getting to do those “extras” that they wanted to do before the pandemic reared its ugly head. It had a little of that “back to normal” feel, even if we aren’t quite there yet. What do you think? Are we normal yet?
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
There was some good news this week, as Republicans and Democrats managed to cooperate long enough to pass the CHIPS Act. Members of the House and Senate don’t usually act until they get worried about being voted out of office, so pardon me if I’m not ready to sing “Happy Days Are Here Again” just yet. But this is still really good news; the politicians are on the record now, and we can hold them accountable.
Myths vs. Facts: The Printed Electronics Roundtable, Part 1
We recently held a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies. In this first part of the roundtable, the participants dispel 10 common myths that have been floating around regarding printed electronic circuits (PEC). They also discuss the progress that’s been made in PEC development in just the past decade, and what the future may hold for this technology.
John Watson Wants You—to Sign Up for His PCB Design Class
I-Connect007 columnist John Watson is teaching an introductory class on PCB design at Palomar College this fall, but this is much more than a basic design class. But John has hit a slight snafu: He needs a few more students to sign up before Aug. 23, or the class will be cancelled. It’s an online class, so you don’t have to live in San Diego to attend. In this interview, John talks about the genesis for the class and its benefits.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The Top 5 list this week contains industry analysis from IPC’s Shawn DuBravac, news on the passage of the U.S. “CHIPS Plus” bill, new materials from Ventec, news about a fab for sale, and a chemistry company completing their acquisition, plus a brand new book in the I-Connect007 eBooks series.
DFM 101: Final Finishes—ENIG and ENIPIG
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability. Final finishes provide a surface for the component assembler to either solder, wire bond, or conductively attach a component pad or lead to a pad, hole, or area of a PCB.
Excerpt: 'The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2'
As the second in this two-part series, The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art builds on the material presented in the first book by describing up-to-the-minute products and design techniques for thermal management with IMS.
Webinar Review: Thermal Integrity of High-Performance PCB Design
Electrical and mechanical engineers may be working on the same product development teams, but they speak different languages, and they have completely different objectives. As a result, these folks almost never use the same software tools. But Cadence’s new Celsius Thermal Solver is an exception to the rule. In a new CadenceTECHTALK webinar, “How Static and Dynamic IR Drop Analysis Can Help PCB Designs and Challenges,” product manager Melika Roshandell and SerDes SI/PI engineer Karthik Mahesh Rao explain how the EE and ME can both use the Celsius Thermal Solver to achieve their disparate objectives.
The Practical Side of Using EM Solvers
Electromagnetic (EM) solvers based on Maxwell’s equations have proven invaluable in the advancement of digital electronics and wireline communications. Plain and simple, electrical engineers need to know what a circuit or electrical interconnect will do when excited by a dynamic or varying signal. In the signal integrity world, an interconnect that passes a DC connectivity check can completely fail at higher frequencies. In the power integrity world, a power rail that measures the correct DC voltage could easily go into oscillation when a dynamic load is applied. Learning the basic skills to fire up an EM simulator, obtain qualitative answers in minutes, and higher fidelity answers in a few days, can be the difference between sleepless nights of product failures vs. robust designs with wide design margins.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Our biggest news this week: I-Connect007 has been acquired by IPC. Every member of the team, including founder and Publisher Barry Matties, is included in this deal. We’ve enjoyed working closely with IPC for decades, especially at events like IPC APEX EXPO, and we have four IPC columnists writing in our magazines and newsletters. This move makes sense for both parties. It enables us to take our magazine, newsletters, and book publishing to the next level, and IPC won’t have to spend years building a media company from the ground up. It really is a win-win.
IPC Acquires Media Company I-Connect007, Strengthening Relationship to Drive Growth and Innovation in the Electronics Industry
IPC, a global electronics manufacturing industry association, has acquired media company I-Connect007, a global source for news and original content serving the printed circuit design, fabrication and assembly/EMS markets.
The Great Divide in PCB Simulation Software
Today’s PCB design engineers have more layout and analysis tools at their disposal than ever before. Over the years we’ve seen layout tools become more automated, rules-driven, and more integrated. Now we even have integration between design tools from different vendors and ranging across domains, starting with basic circuit design, and spanning up to PLM and ERP integration. It really is a great time to be a designer.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s always interesting how certain groups of news emerge in our most-read content. This week, reader interest seemed focused on two distinct themes: Mexico and awards. In this week’s list, we find the inaugural award recipients from iNEMI’s Project Leadership Awards. We also bring you the award recipients from the SEMI FlexTech conference held last week in San Francisco. News from Mexico includes a new Atotech facility, and an interview with IPC’s David Hernandez and Lorena Villanueva about IPC’s expanding presence in Mexico. Metcal’s new hot air rework system also got a lot of attention, with an abundance of reader interest.
The Importance of Rigid-Flex PCB Design Guidelines
I have the tendency to try to replicate the delicacies I’ve ordered at restaurants in my own kitchen. One of my latest attempts at creating restaurant-worthy dishes was a Korean pancake that’s crispy on the outside but soft on the inside. With my amateur cooking skills, it proved to be an impossible task—I could either make only a hard pancake or one that was total fluff. While I’m still struggling to figure out the trick to bringing together the different textures of a Korean pancake, I’ve had more success in bringing together the hardboard elements and flexible PCB elements of a rigid-flex PCB. Compared to making Korean pancakes, striking the right balance of flexibility and rigidity on a rigid-flex PCB is easy if you abide by rigid-flex PCB design guidelines.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
I’m getting a lot of out-of-office replies. Are you all on the beach now? It’s 91 degrees every day here in Atlanta lately, but each afternoon it rains like we’re in a horror movie, and that drops the temperature down to the subtropical arena. Still, I’ll take heat over freezing any day. Things are heating up in our industry too, as we see from my top five choices this week. First-quarter electronic design revenue is up year-on-year, but PCB revenue barely moved the needle YOY. Editor Nolan Johnson spent the week at SEMICON West and the FLEX Conference, and he brings us a review of these conferences, co-located at the Moscone Center in San Francisco. As he notes, printed electronic circuits are beginning to gain a foothold in the market.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
In more than one conversation while discussing the industry this week, the themes have included industry turmoil, lots of business opportunities, and the urgent need to build out to meet changing demands. In fact, our July issue of PCB007 Magazine, which publishes later this month, will focus on these very topics. It’s definitely one not to be missed!
These themes also emerged in this week’s top five news items as well. Top stories include an acquisition in the soldering machinery space, sales and service expansion in Mexico, industry data from SIA on semiconductor global sales data, and strong financial numbers from two China-based manufacturers. Now, with the U.S. Congress putting its focus on the PCB industry, things could really heat up. It’s going to be an interesting year.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The summer is heating up, and our news this week is on fire, literally. Eltek has resumed making deliveries after a fire at their facility in Petach-Tikva, Israel. There’s never a dull moment in this industry. And we have some good news: EIPC’s conferences are now live events again, and Editor Pete Starkey is back in the saddle, bringing us a review of the two-day conference. I know Pete was getting tired of sitting around his house and watching these events on video.
Rambus Driving a CXL Memory Option
In this interview with Arjun Bangre, director of product for high-speed interface IPs for PCI Express and CXL at Rambus, the discussion revolves around new developments in CXL, PCI Express, and interoperable IP solutions that Rambus has developed.
Master the Art of Communication With Manufacturers
As mentioned in the May issue of Design007 Magazine, design is performed, at times, in a vacuum. But it doesn’t have to be that way. Whenever circumstances allow, design should be performed by communicating with all stakeholders throughout the design process, hence the emphasis on the word with in DWM. Communication can occur through personal correspondence such as email and voice conversations or through more formal design meetings—in person or through videoconferencing. No matter which means of communication you prefer, it’s important to communicate early and often with stakeholders involved in the downstream processes as you bring your project to realization.
EIPC Summer Conference 2022: Day 2 Review
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.
The U.S. Economy Needs the Bipartisan Innovation Act and the PCB Act
In this IPC-created interview between Dale Curtis, IPC Advocacy Communications and Chris Mitchell, IPC VP Global Government Relations, the importance of the semiconductor and PCB manufacturing legislation moving through US Congress is highlighted.
EIPC Summer Conference 2022: Day 1 Review
At last, a live EIPC conference and this time in the Swedish city of Örebro, “where history and contemporary culture converge,” a pleasant and convenient location for an event that included a privileged visit to the Ericsson facility in Kumla. Around 100 delegates made the journey and the Örebro Scandic Grand Hotel was an excellent conference venue for the June 14-15 conference.
Ventec’s Book on Thermal Management: The Summer Sequel You’ve Been Waiting For
I-Connect007 is excited to announce the release of the second title in Ventec’s series on thermal management, "The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates, Volume 2." This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples, and focusing on specific solutions and enhanced properties of IMS.
Altimade Puts Designers and Manufacturers Together
Despite all of the talk about the need for communication between designers and manufacturers, many PCB designers still do not talk with their manufacturers for a variety of reasons. Altium and MacroFab aim to change this dynamic. In this interview, Ted Pawela, chief ecosystem officer of Altium and head of Altium’s Nexar Business Unit, and MacroFab CEO Misha Govshteyn, discuss the new Altimade manufacturing service that Altium is introducing in partnership with MacroFab. Ted and Misha provide an overview of the Altimade process, how it links designers to fabricators, assembly providers, and component distributors, and they explain how it could pave the way for true design with manufacturing, or DWM.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Market news was certainly big this week. While the U.S. stock market continues make some large swings, the PCB and PCBA are doing their own dance with the numbers. We’re still feeling the effects of the pandemic, but it seems to be more about playing catch up. Still, the industry is showing some instability, both in positive and negative ways.
The Survey Said: Why Don’t You Know Your Fabricator?
When we want to find out what challenges our readers are facing, we just ask. And they don’t mind sharing—the good, the bad, and the ugly. In a recent survey, we asked our PCB designer readers, “Why don’t you know who is going to manufacture your boards?” Here are some of more interesting replies we received, edited slightly for clarity. Do you see yourself in these replies?
Assemblers Play the ‘Revise or Wait’ Game With Designers
Nolan Johnson recently spoke with Duane Benson at Milwaukee Electronics and Screaming Circuits. Duane was pointing out a trend in moving designs into production, which he termed “revise or wait.” This excerpt provides a preview of our exploration of similar topics involving supply chain issues, lead times, and proceeding forward despite the supply challenges.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We’re still not officially into summer yet, but Atlanta is bringing the heat, baby! It’s hit 97 degrees a few times this week, and I now have a fan aimed right at my face. At least it’s nice and humid too. I’m glad I don’t wear make-up. And it’s been a hot week in the circuit board community. This week, Eltek reported a fire at a board shop in Israel, and Flex committed to building a 145,000-square-foor facility in Jalisco, Mexico to serve the electric and autonomous vehicle segment.
Producing Diverse Designs in Concert With Manufacturing
There is a new acronym bubbling up in the design world: DWM, which stands for “design with manufacturing.” Why is this different than design for manufacturing, or DFM? With DWM, the emphasis is on integration between the design team and the manufacturers during the design process. DWM is much more than that. We are tasked with producing designs that meet various technical requirements, yet are cost-effective and manufacturable. We provide this service to hundreds of customers who have varying degrees of processes, tools, and manufacturing partners. Given this diversity, we have recognized the importance of designing with manufacturing to achieve the product development goals of manufacturability and technical excellence.
I-Connect007 Editor’s Picks: Five Must-Reads for the Week
PCB fabrication is back in the news this week and posting high readership numbers as well. Among the most-read news, we see industry leaders changing roles, capital equipment shipment milestones, operational cost efficiencies, and, last but not least, cybersecurity.
Passionate People Can Do Fantastic Things
Electrical engineer Marshall Massengill is the first to admit that he has a pretty sweet gig. Marshall serves as a mentor for the Zebracorns, a robotics team based at a STEM-oriented high school in North Carolina. And he’s not just a mentor: He’s also a graduate of North Carolina School of Science and Mathematics, and a former member of one of the earliest robotics teams organized by FIRST. We recently spoke with Marshall about his work with the FIRST robotics team, and what it’s like teaching PCB design to juniors and seniors in high school.
The Survey Said: Designing Around Missing Data
One of the best tools we have for keeping our fingers on the pulse of the industry is the reader survey. When we want to find out what’s going on, we just ask. Fortunately, our readers are not a shy bunch of folks. They don’t mind sharing—the good, the bad, and the ugly. In a recent survey, we asked our PCB designer readers, “What missing information or data (impedance requirements, library data, etc.) do you find yourself having to ‘design around’?”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Things are heating up in the world of PCB design and manufacturing as well. In the past week, we published quite a bit of news—some good, some not so good. Some of the news is mixed, as we see with the EMS industry shipments rising YOY in April, but falling from the previous month. It’s nice to see NASA investing in American small businesses, but they didn’t really have a choice, did they?
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
I know I’m not alone in this behavior: Car advertisements during television commercial breaks are as good as invisible to me, until I’m thinking about getting a new car. Only then do I notice them. Rather, I see each one with all my attention and being. If that extends into our industry, then everybody must be itching to pick up some new equipment. This week’s must-reads includes a smattering of new product announcements, along with the news of the IPC European subsidiary.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, we bring you an article about manufacturing training for veterans, and a review of a great signal integrity webinar. IPC honors its A-Teams with the coveted Golden Gnome Awards, and Technica discusses various ways for fabricators to increase ROI. Dan Beaulieu has a review of a really cool book: Back to Human—How Great Leaders Create Connection in the Age of Isolation. In spite of all the meetings on Teams and Zoom, it’s easy to feel disconnected. But great leaders find a way to foster that connectivity.
Altium Focusing on Educating Designers of Today and Tomorrow
We recently spoke with Rea Callender, Altium’s vice president of education, and Zach Peterson, founder of Northwest Engineering Solutions and a technical consultant for Altium’s educational programs. They discussed Altium’s curriculum—what drives the content development, the goals of their programs, and why there’s never been a better time to continue your PCB design education.
Pulsonix Collision Avoidance to Bring Mechanical Capabilities Into ECAD
The I-Connect Editorial Team recently spoke with Bob Williams, managing director of Pulsonix. He discussed some of the new features in the upcoming version of the Pulsonix PCB design tool, Version 12, including collision avoidance and other 3D options that allow certain MCAD functions within the ECAD environment.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The big news in the industry this week was the new bill introduced to the U.S. Congress in support of the PCB manufacturing industry. The Supporting American Printed Circuit Boards Act of 2022, which was introduced by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), incentivizes “purchases of domestically produced PCBs as well as industry investments in factories, equipment, workforce training, and research and development.” The bill is a PCB-oriented complement to the semiconductor-oriented CHIPS Act of 2021.
Designing in a Vacuum Q&A: Mark Thompson
I-Connect007 Columnist Mark Thompson of Out of the Box Manufacturing has been in CAM engineering for decades, and he’s also worked as a PCB designer, so we knew he would have a few things to say about working in a vacuum. As he explains, the designer isn’t the only stakeholder in the process who feels like he’s working inside the dust bag of a Hoover upright.
Designing in a Vacuum Q&A: Carl Schattke
Not long ago, I caught up with Carl Schattke, CEO of PCB Product Development LLC and a longtime PCB designer, for his thoughts on “designing in a vacuum.” As Carl points out, if you follow PCB design best practices, knowing the identity of your fabricator is not a “must-have.” He also offers some communication tips for discovering the information you do need, including one old-fashioned technique—just asking for it.
Tips for Designing in—and Escaping From—the Vacuum
We asked Monsoon Solutions VP of Engineering Jen Kolar if she had any thoughts on “designing in a vacuum,” and her response was, “Absolutely!” In this wide-ranging discussion, Jen and Senior PCB Engineer and Director of Designer Development Cory Grunwald share some tips and techniques for designing PCBs in a vacuum, and a few methods for getting out of the Hoover’s dust bag. As Cory points out, “In the end, the communication is going to happen anyway. It’s just a matter of whether it happens at the end or in the beginning.”
Additive Manufacturing Requires Additive Design Techniques
Although I am not a designer by trade, I want to share my thoughts on what additive manufacturing means for designers, especially how it relates to solder mask. In this article, you will learn what topics I feel are the most important to address.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, we have some M&A news from Summit Interconnect, and a variety of columns. Chris Bonsell discusses the lack of preventive maintenance planning in PCB manufacturing, and Kelly Dack lays out some solder mask guidelines for PCB designers. Duane Benson helps make sense of the quoting process in a time of 50-week lead times, and Dan Beaulieu has a great review of a book about how shareholder policies have caused many of the problems we see in corporations today.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
It certainly seems that our times continue to be interesting, don’t they? Just how many different flavors of supply chain disruption can we come up with? Investment on the supply side needs to increase, but the size of the labor force needs to increase even more, if we want to accomplish the task of the buildout itself, let alone running the facilities properly.
Designing PCBs With Additive Traces
Advances in technology have been clear to see within the component packaging industry, as the ball grid array (BGA) package sizes reduce from 1.0 mm pitch to 0.8 mm, 0.4 mm, and even beyond. However, while these improvements have occurred with component packages, it has become increasingly more difficult to break out and route the dense circuitry associated with these parts. Currently, the high-density interconnect (HDI) method typically used for the breakout of such parts has been to create the smallest possible subtractive-etched traces with microvias to allow for connections and escapes on the innerlayers of your PCB.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication, and assembly communities. The roller coaster ride continues, with whiplash-inducing news from IPC about March North American shipment—they’re up from February but down from the same period a year ago.
AltiumLive 2022: Tips and Tricks for Supply Chain Management
I recently spoke with Paul Ratner, a senior account executive at IHS Markit, about his AltiumLive presentation, which is now available online. Paul discusses some of the takeaways from his presentation, and he offers some advice for technologists who are grappling with long lead times on components, as well as some predictions for the rest of 2022 and beyond.
The Printed Circuit Designer’s Guide to… Stackups: The Design within the Design
If you have ever contemplated crosstalk, eye closure, power loss, or a list of other issues defined in this textbook, then you also need to understand what, why, and how stackups can and will impact your circuit’s performance. After all, the stackup is one of the few things that directly touches every single part of your design; therefore, you must set yourself up for the highest probability of success by establishing a strong foundation through a well-designed stackup.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Welcome to April 15, everyone! There are reasons we tend to cover topics in a continuous conversation. First, there are always developments and news in the industry. Second, you dear readers respond to that content by reading it. This week the news items that drew the most reader interest verify that our industry has ongoing interest in government involvement in industry infrastructure, supply chain issues, cybersecurity, and new technologies like additive in fabrication.
Cadence System Design Solutions Guide Available Now
You already have the I-Connect007 book "The System Designer's Guide to... System Analysis", written by Brad Griffin of Cadence Design Systems. Now, download the bonus companion guide, "The Cadence System Design Solutions Guide" for solutions to all your complex system analysis needs. Put Cadence’s expert knowledge into action!
A Definitive Review of New Expert Guide to High-Performance Materials
I am always surprised when a colleague produces a statement about PCB laminates that seems incorrect or out of date. This need not happen today as the specialists at Isola have written an excellent book about high performance materials, now available for download from I-Connect007. Author Michael Gay, a 25-year veteran of laminate manufacturing, meticulously guides readers through the most pertinent questions regarding rigid laminates. This is essential information for everyone, including the experts, because the materials and applications for laminates in printed circuits are constantly changing.
Altium Invests in Future Designers
While at IPC APEX EXPO, I stopped by the Altium booth to visit with Rea Callender, vice president of education at Altium. Rea shared information about the company’s recent design competition for students around the world, as well as a new curriculum that is drawing interest from some unique locations.
Additive Design: Same Steps, Different Order
We recently spoke with Dave Torp, CEO of Winonics, about the company’s additive and semi-additive processes and what PCB designers need to know if they’re considering designing boards with these new technologies. As Dave explains, additive design is not much different from traditional design, but the steps in the design cycle are out of order, and additive designers must communicate with their fabricators because so much of the new processes are still proprietary.
AltiumLive 2022 - Vince Mazur’s Supply Chain Advice: Always Have Alternatives
I had the chance to speak with Vince Mazur, a technical marketing engineer at Altium, about his AltiumLive presentation, “Avoiding Supply Chain Issues with Variants and Live Part Choices,” which is now available online. Vince discussed some of the high points of his talk, including the need for designers to pay closer attention to the supply chain than ever before, and to always have an alternative part or two as backup—just in case.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Spring has definitely sprung, and the trade show season continues to roll right along. Managing Editor Nolan Johnson just returned from DesignCon 2022, and as he says in his review, the attendance was up from last year’s event, which had been at the McEnery Convention Center in the waning days of the pandemic. I hope we’re getting back to normal, whatever that means. This week, we have a few articles about Industry 4.0, as well as a column on setting your priorities. We have a cool article about methods for measuring the breakdown of resins during multiple thermal laminations, and a conversation with an EMS company president who realized that he was actually running a data collection firm that happened to make circuit boards. Can you say the same about your own company?
AltiumLive 2022: Dwight Morse Offers a Supply Chain Primer
I recently spoke with Dwight Morse, channel marketing manager for SiliconExpert, about his AltiumLive presentation, “Getting the Information to Create Successful Designs Quickly,” which is available online now. Dwight offers advice to designers who are facing 50-week component lead times, and he discusses some of the trends he sees in the supply chain right now, including a view from the vantage point of the world’s top video game makers, who are having as much trouble finding parts as you are.
