Ventec International Materials Certified to Latest IPC-4101 Revision E

Reading time ( words)

Further to the latest release of the IPC-4101 revision E, Ventec International Group announces that as of 1st July 2017, all related products are certified and released to the IPC-4101E standard.

Following an internal review process, Ventec materials meet all the requirements of the new IPC-4101 Revision E standard (Specification for Base Materials for Rigid and Multilayer Printed Boards). Back in 2014, Ventec International Group declared its support for the proposal led by ESA, the European Space Agency, to define supplemental requirements to the IPC4101D specification for base materials for rigid and multilayer PCBs. The latest revision E of the specification replaces IPC-4101D-WAM1 and formally includes an Appendix A that provides supplemental inspection requirements for base materials used in high-reliability PCBs for critical applications, with particular reference to the prevention and detection of foreign material inclusions (FOD) early in the supply chain.

Ventec has been inspecting, testing, and releasing materials to the standard for many years. The company continues its commitment to ongoing strategic investments in clean-room equipment and facilities that demonstrate Ventec’s principles of continuous improvement to consistently achieve the highest delivered quality to all its customers including military & aerospace and automotive customers. The latest investments will add AOI onto all treaters in Suzhou, China starting with highest reliability materials for high reliability applications (VT-901 and VT-90H polyimide as well as the full range of No Flow / Low Flow prepregs for rigid flex applications). 

Mark Goodwin, COO Europe & USA commented: "Our approach to manufacturing and supplying laminates & prepregs covers the entire supply chain. We follow rigorous procurement, manufacturing and auditing processes at all our manufacturing sites and global service centers to ensure our materials and our services are consistently of the highest quality. This includes ensuring that our materials always comply with the prevailing standards."

About Ventec International

With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.

07/12/2023 | Barry Matties, I-Connect007

Jeff De Serrano, president of PCB Technologies North America, gives an update on the company’s recent move into advanced packaging—a move that stemmed from company leadership and vision for the future. He also shares his forecast on the PCB market, specifically around rigid-flex, along with some of the challenges the industry still faces.

06/30/2023 | Nolan Johnson, I-Connect007

It’s a heady time here in the U.S. between the summer holidays of Memorial Day (last Monday in May) and Independence Day (July 4). This four-week period straddles the Northern solstice, boasts the longest days of the year in the Northern Hemisphere. This is the high season for outside activities, which may be pulling you away from the office. Am I right? Never fear, I-Connect007 is here to deliver the “must know” news stories.

06/29/2023 | Barry Matties, I-Connect007

During the recent IEEE IMS2023 Exhibition in San Diego, we caught up with James Hofer, general manager of Accurate Circuit Engineering (ACE). The company is a prototype manufacturer of bare printed circuit boards that specializes in high-mix, low volume with an emphasis on RF, microwave, and antennas. A few years ago, we talked to James about the over-materialization of boards. In this recent discussion, we wanted to know if anything has changed regarding materials and approach. James also shares his thoughts on the changes in the design community.